June 25-26, 2020 – Young Talents work on challenges of the packaging industry

June 25-26, 2020 – Young Talents work on challenges of the packaging industry

The preparations for the 1. Packaging Valley Remote Makeathon from June 25th to 26th, 2020 are in the final round. The organizers Packaging Valley Germany e.V. (PV), Packaging Excellence Center Region Stuttgart (PEC), Wirtschaftsförderung Region Stuttgart and ITQ GmbH are expecting around 80 students and technology-minded participants from various universities and cities. The 1. Packaging Valley Remote Makeathon will take place decentrally at five locations in a team size of 10-20 people in order to comply with the current safety regulations due to the corona pandemic. The groups and participants are connected to each other via collaboration tools and video conference systems.

During the two-day MAKEATHON the participants will work on challenges of the five MAKEATHON partners Optima and hfcon, Rommelag, Syntegon, Kempten University of Applied Sciences and KIT / Dassault Systèmes. At the Optima location in Schwäbisch Hall, the Makeathon participants will deal with the challenge “Sustainable shopping of the future from a consumer perspective”.

Also in Schwäbisch Hall, KIT / Dassault Systèmes invites the participants to the challenge “Efficient processes for product development in packaging machine construction”. Rommelag in Sulzbach Laufen is about “Remote FATs and concepts as well as measures for the virtual acceptance of machines”. In Waiblingen at Syntegon premisses, the participants deal with the question “How can digital information from a packaging machine be digitized and analyzed?”. The Kempten University of Applied Sciences offers its participants the opportunity to deal with the topic of “robotics / human cooperation”, the so-called cobots.

As part of the 1. Packaging Valley Remote Makeathon, the focus is on what further development potential the industry has in the area of ​​digitization and mechatronics, what consequences can be derived from the corona crisis and how sustainable packaging technology can be advanced through digitization and mechatronics.

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2020-06-30T18:00:06+02:00 Uncategorized|