{"id":17184,"date":"2020-06-24T16:28:43","date_gmt":"2020-06-24T14:28:43","guid":{"rendered":"https:\/\/www.itq.de\/?p=17184"},"modified":"2021-05-04T17:42:11","modified_gmt":"2021-05-04T15:42:11","slug":"young-talents-work-on-challenges-of-the-packaging-industry","status":"publish","type":"post","link":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/","title":{"rendered":"Young Talents work on challenges of the Packaging Industry"},"content":{"rendered":"<div class=\"fusion-fullwidth fullwidth-box fusion-builder-row-1 nonhundred-percent-fullwidth non-hundred-percent-height-scrolling\"  style='background-color: rgba(255,255,255,0);background-position: center center;background-repeat: no-repeat;padding-top:0px;padding-right:0px;padding-bottom:20px;padding-left:0px;'><div class=\"fusion-builder-row fusion-row \"><div  class=\"fusion-layout-column fusion_builder_column fusion_builder_column_1_1 fusion-builder-column-0 fusion-one-full fusion-column-first fusion-column-last 1_1\"  style='margin-top:0px;margin-bottom:20px;'><div class=\"fusion-column-wrapper\" style=\"padding: 0px 0px 0px 0px;background-position:left top;background-repeat:no-repeat;-webkit-background-size:cover;-moz-background-size:cover;-o-background-size:cover;background-size:cover;\"   data-bg-url=\"\"><span class=\"fusion-imageframe imageframe-none imageframe-1 hover-type-none\"><img decoding=\"async\" src=\"https:\/\/www.itq.de\/wp-content\/uploads\/2018\/08\/Leere-1.jpg\" width=\"60\" height=\"20\" alt=\"\" title=\"Leere\" class=\"img-responsive wp-image-6305\"\/><\/span><div class=\"fusion-text\"><p>The preparations for the<strong>\u00a01. Packaging Valley Remote Makeathon from June 25th to 26th, 2020<\/strong>\u00a0are in the final round. The organizers\u00a0<a href=\"https:\/\/www.packaging-valley.com\/vr-center\/\">Packaging Valley Germany e.V. (PV)<\/a>,\u00a0<a href=\"https:\/\/packaging-excellence.com\/\">Packaging Excellence Center Region Stuttgart (PEC)<\/a>,\u00a0<a href=\"https:\/\/wrs.region-stuttgart.de\/\">Wirtschaftsf\u00f6rderung Region Stuttgart<\/a>\u00a0and\u00a0<a href=\"https:\/\/www.itq.de\/en\/\">ITQ GmbH<\/a>\u00a0are\u00a0<strong>expecting around 80 students and technology-minded participants from various universities and cities.<\/strong>\u00a0The\u00a0<strong>1. Packaging Valley Remote Makeathon<\/strong>\u00a0will take place decentrally at\u00a0<strong>five locations in a team size of 10-20 people<\/strong>\u00a0in order to comply with the current safety regulations due to the corona pandemic. The groups and participants are connected to each other via collaboration tools and video conference systems.<\/p>\n<p>During the\u00a0<strong>two-day MAKEATHON<\/strong>\u00a0the participants will work on challenges of the\u00a0<strong>five MAKEATHON partners<\/strong>\u00a0<a href=\"https:\/\/www.optima-packaging.com\/en\">Optima<\/a>\u00a0and\u00a0<a href=\"https:\/\/www.hfcon.de\/english\">hfcon<\/a>,\u00a0<a href=\"https:\/\/www.rommelag.com\/en\/\">Rommelag<\/a>,\u00a0<a href=\"https:\/\/www.syntegon.com\/\">Syntegon<\/a>,\u00a0<a href=\"https:\/\/www.hs-kempten.de\/home.html\">Kempten University of Applied Sciences<\/a>\u00a0and\u00a0<a href=\"https:\/\/www.3ds.com\/de\/\">KIT \/ Dassault Syst\u00e8mes<\/a>. At the Optima location in Schw\u00e4bisch Hall, the Makeathon participants will deal with the challenge\u00a0<strong>\u201cSustainable shopping of the future from a consumer perspective\u201d<\/strong>.<\/p>\n<\/div><span class=\"fusion-imageframe imageframe-none imageframe-2 hover-type-none\"><img decoding=\"async\" src=\"https:\/\/www.itq.de\/wp-content\/uploads\/2018\/08\/Leere-1.jpg\" width=\"60\" height=\"20\" alt=\"\" title=\"Leere\" class=\"img-responsive wp-image-6305\"\/><\/span><span class=\"fusion-imageframe imageframe-none imageframe-3 hover-type-none\"><img decoding=\"async\" src=\"https:\/\/www.itq.de\/wp-content\/uploads\/2020\/06\/Packaging_Valley_Makeathon_Sponsoren.jpg\"   alt=\"\" title=\"\" class=\"img-responsive\"\/><\/span><span class=\"fusion-imageframe imageframe-none imageframe-4 hover-type-none\"><img decoding=\"async\" src=\"https:\/\/www.itq.de\/wp-content\/uploads\/2018\/08\/Leere-1.jpg\" width=\"60\" height=\"20\" alt=\"\" title=\"Leere\" class=\"img-responsive wp-image-6305\"\/><\/span><div class=\"fusion-text\"><p>Also in Schw\u00e4bisch Hall, <strong>KIT \/ Dassault Syst\u00e8mes<\/strong> invites the participants to the challenge<strong>\u00a0\u201cEfficient processes for product development in packaging machine construction\u201d<\/strong>. Rommelag in Sulzbach Laufen is about<strong>\u00a0\u201cRemote FATs and concepts as well as measures for the virtual acceptance of machines\u201d<\/strong>. In Waiblingen at <strong>Syntegon<\/strong> premisses, the participants deal with the question\u00a0<strong>\u201cHow can digital information from a packaging machine be digitized and analyzed?\u201d<\/strong>. The Kempten University of Applied Sciences offers its participants the opportunity to deal with the topic of\u00a0<strong>\u201crobotics \/ human cooperation\u201d,<\/strong>\u00a0the so-called cobots.<\/p>\n<p>As part of the\u00a0<strong>1. Packaging Valley Remote Makeathon<\/strong>, the focus is on what further\u00a0<strong>development potential the industry has in the area of \u200b\u200bdigitization and mechatronics,<\/strong>\u00a0what consequences can be derived from the corona crisis and how<strong>\u00a0sustainable packaging technology can be advanced through digitization and mechatronics<\/strong>.<\/p>\n<\/div><style type=\"text\/css\"><\/style><div class=\"fusion-title title fusion-title-1 fusion-sep-none fusion-title-text fusion-title-size-five\" style=\"margin-top:40px;margin-bottom:31px;\"><h5 class=\"title-heading-left\" style=\"margin:0;\">More Information:<\/h5><\/div><div class=\"fusion-fa-align-left\"><i class=\"fb-icon-element-1 fb-icon-element fontawesome-icon fa-globe-americas fas circle-no fa-line-height\" style=\"font-size:18px;margin-right:9px;\"><\/i><\/div><style>i.fontawesome-icon.fb-icon-element-1{ color: #007cc3;}i.fontawesome-icon.fb-icon-element-1:hover { color: #007cc3;}<\/style><div class=\"fusion-text\"><p><a href=\"https:\/\/makeathon.packaging-valley.com\" target=\"_blank\" rel=\"noopener\">Packaging Valley Remote Makeathon &#8211; Registration<\/a><\/p>\n<\/div><div class=\"fusion-fa-align-left\"><i class=\"fb-icon-element-2 fb-icon-element fontawesome-icon fa-globe-americas fas circle-no fa-line-height\" style=\"font-size:18px;margin-right:9px;\"><\/i><\/div><style>i.fontawesome-icon.fb-icon-element-2{ color: #007cc3;}i.fontawesome-icon.fb-icon-element-2:hover { color: #007cc3;}<\/style><div class=\"fusion-text\"><p><a href=\"https:\/\/www.packaging-valley.com\/\" target=\"_blank\" rel=\"noopener\">Packaging Valley (PV) &#8211; Homepage<\/a><\/p>\n<\/div><div class=\"fusion-fa-align-left\"><i class=\"fb-icon-element-3 fb-icon-element fontawesome-icon fa-globe-americas fas circle-no fa-line-height\" style=\"font-size:18px;margin-right:9px;\"><\/i><\/div><style>i.fontawesome-icon.fb-icon-element-3{ color: #007cc3;}i.fontawesome-icon.fb-icon-element-3:hover { color: #007cc3;}<\/style><div class=\"fusion-text\"><p><a href=\"https:\/\/packaging-excellence.com\/\" target=\"_blank\" rel=\"noopener\">Packaging Excellence Center (PEC) &#8211; Homepage<\/a><\/p>\n<\/div><div class=\"fusion-clearfix\"><\/div><\/div><\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":7,"featured_media":17112,"comment_status":"open","ping_status":"open","sticky":false,"template":"","format":"standard","meta":{"_acf_changed":false,"footnotes":""},"categories":[16,37],"tags":[],"class_list":["post-17184","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-events","category-news-en-2"],"acf":[],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.1.1 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Young Talents work on challenges of the Packaging Industry - ITQ GmbH<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Young Talents work on challenges of the Packaging Industry - ITQ GmbH\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/\" \/>\n<meta property=\"og:site_name\" content=\"ITQ GmbH\" \/>\n<meta property=\"article:published_time\" content=\"2020-06-24T14:28:43+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2021-05-04T15:42:11+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.itq.de\/wp-content\/uploads\/2020\/06\/1-Packaging-Valley-Remote-Makeathon-2020.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"785\" \/>\n\t<meta property=\"og:image:height\" content=\"285\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"Anis Kossentini\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"Anis Kossentini\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#article\",\"isPartOf\":{\"@id\":\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/\"},\"author\":{\"name\":\"Anis Kossentini\",\"@id\":\"https:\/\/www.itq.de\/en\/#\/schema\/person\/06a2fb9fd2f95dcebebedd110a16d27e\"},\"headline\":\"Young Talents work on challenges of the Packaging Industry\",\"datePublished\":\"2020-06-24T14:28:43+00:00\",\"dateModified\":\"2021-05-04T15:42:11+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/\"},\"wordCount\":1077,\"commentCount\":0,\"publisher\":{\"@id\":\"https:\/\/www.itq.de\/en\/#organization\"},\"image\":{\"@id\":\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.itq.de\/wp-content\/uploads\/2020\/06\/1-Packaging-Valley-Remote-Makeathon-2020.jpg\",\"articleSection\":[\"Events\",\"News\"],\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"CommentAction\",\"name\":\"Comment\",\"target\":[\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#respond\"]}]},{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/\",\"url\":\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/\",\"name\":\"Young Talents work on challenges of the Packaging Industry - ITQ GmbH\",\"isPartOf\":{\"@id\":\"https:\/\/www.itq.de\/en\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.itq.de\/wp-content\/uploads\/2020\/06\/1-Packaging-Valley-Remote-Makeathon-2020.jpg\",\"datePublished\":\"2020-06-24T14:28:43+00:00\",\"dateModified\":\"2021-05-04T15:42:11+00:00\",\"breadcrumb\":{\"@id\":\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#primaryimage\",\"url\":\"https:\/\/www.itq.de\/wp-content\/uploads\/2020\/06\/1-Packaging-Valley-Remote-Makeathon-2020.jpg\",\"contentUrl\":\"https:\/\/www.itq.de\/wp-content\/uploads\/2020\/06\/1-Packaging-Valley-Remote-Makeathon-2020.jpg\",\"width\":785,\"height\":285},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Startseite\",\"item\":\"https:\/\/www.itq.de\/en\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Young Talents work on challenges of the Packaging Industry\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.itq.de\/en\/#website\",\"url\":\"https:\/\/www.itq.de\/en\/\",\"name\":\"ITQ GmbH\",\"description\":\"Dienstleistung und Beratung f\u00fcr Embedded Systems, Maschinen und Anlagen\",\"publisher\":{\"@id\":\"https:\/\/www.itq.de\/en\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.itq.de\/en\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Organization\",\"@id\":\"https:\/\/www.itq.de\/en\/#organization\",\"name\":\"ITQ GmbH\",\"url\":\"https:\/\/www.itq.de\/en\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/www.itq.de\/en\/#\/schema\/logo\/image\/\",\"url\":\"https:\/\/www.itq.de\/wp-content\/uploads\/2019\/03\/ITQ_Logo-1.jpg\",\"contentUrl\":\"https:\/\/www.itq.de\/wp-content\/uploads\/2019\/03\/ITQ_Logo-1.jpg\",\"width\":1442,\"height\":812,\"caption\":\"ITQ GmbH\"},\"image\":{\"@id\":\"https:\/\/www.itq.de\/en\/#\/schema\/logo\/image\/\"}},{\"@type\":\"Person\",\"@id\":\"https:\/\/www.itq.de\/en\/#\/schema\/person\/06a2fb9fd2f95dcebebedd110a16d27e\",\"name\":\"Anis Kossentini\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/www.itq.de\/en\/#\/schema\/person\/image\/\",\"url\":\"https:\/\/secure.gravatar.com\/avatar\/3085b577714a8c5fc859f06be797ec3d57b30c3e4a2b6d8842c1f0a5141291cc?s=96&d=mm&r=g\",\"contentUrl\":\"https:\/\/secure.gravatar.com\/avatar\/3085b577714a8c5fc859f06be797ec3d57b30c3e4a2b6d8842c1f0a5141291cc?s=96&d=mm&r=g\",\"caption\":\"Anis Kossentini\"},\"sameAs\":[\"https:\/\/www.itq.de\"],\"url\":\"https:\/\/www.itq.de\/en\/author\/kossentini\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Young Talents work on challenges of the Packaging Industry - ITQ GmbH","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/","og_locale":"en_US","og_type":"article","og_title":"Young Talents work on challenges of the Packaging Industry - ITQ GmbH","og_url":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/","og_site_name":"ITQ GmbH","article_published_time":"2020-06-24T14:28:43+00:00","article_modified_time":"2021-05-04T15:42:11+00:00","og_image":[{"width":785,"height":285,"url":"https:\/\/www.itq.de\/wp-content\/uploads\/2020\/06\/1-Packaging-Valley-Remote-Makeathon-2020.jpg","type":"image\/jpeg"}],"author":"Anis Kossentini","twitter_card":"summary_large_image","twitter_misc":{"Written by":"Anis Kossentini","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#article","isPartOf":{"@id":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/"},"author":{"name":"Anis Kossentini","@id":"https:\/\/www.itq.de\/en\/#\/schema\/person\/06a2fb9fd2f95dcebebedd110a16d27e"},"headline":"Young Talents work on challenges of the Packaging Industry","datePublished":"2020-06-24T14:28:43+00:00","dateModified":"2021-05-04T15:42:11+00:00","mainEntityOfPage":{"@id":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/"},"wordCount":1077,"commentCount":0,"publisher":{"@id":"https:\/\/www.itq.de\/en\/#organization"},"image":{"@id":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#primaryimage"},"thumbnailUrl":"https:\/\/www.itq.de\/wp-content\/uploads\/2020\/06\/1-Packaging-Valley-Remote-Makeathon-2020.jpg","articleSection":["Events","News"],"inLanguage":"en-US","potentialAction":[{"@type":"CommentAction","name":"Comment","target":["https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#respond"]}]},{"@type":"WebPage","@id":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/","url":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/","name":"Young Talents work on challenges of the Packaging Industry - ITQ GmbH","isPartOf":{"@id":"https:\/\/www.itq.de\/en\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#primaryimage"},"image":{"@id":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#primaryimage"},"thumbnailUrl":"https:\/\/www.itq.de\/wp-content\/uploads\/2020\/06\/1-Packaging-Valley-Remote-Makeathon-2020.jpg","datePublished":"2020-06-24T14:28:43+00:00","dateModified":"2021-05-04T15:42:11+00:00","breadcrumb":{"@id":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#primaryimage","url":"https:\/\/www.itq.de\/wp-content\/uploads\/2020\/06\/1-Packaging-Valley-Remote-Makeathon-2020.jpg","contentUrl":"https:\/\/www.itq.de\/wp-content\/uploads\/2020\/06\/1-Packaging-Valley-Remote-Makeathon-2020.jpg","width":785,"height":285},{"@type":"BreadcrumbList","@id":"https:\/\/www.itq.de\/en\/2020\/06\/24\/young-talents-work-on-challenges-of-the-packaging-industry\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Startseite","item":"https:\/\/www.itq.de\/en\/"},{"@type":"ListItem","position":2,"name":"Young Talents work on challenges of the Packaging Industry"}]},{"@type":"WebSite","@id":"https:\/\/www.itq.de\/en\/#website","url":"https:\/\/www.itq.de\/en\/","name":"ITQ GmbH","description":"Dienstleistung und Beratung f\u00fcr Embedded Systems, Maschinen und Anlagen","publisher":{"@id":"https:\/\/www.itq.de\/en\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.itq.de\/en\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Organization","@id":"https:\/\/www.itq.de\/en\/#organization","name":"ITQ GmbH","url":"https:\/\/www.itq.de\/en\/","logo":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.itq.de\/en\/#\/schema\/logo\/image\/","url":"https:\/\/www.itq.de\/wp-content\/uploads\/2019\/03\/ITQ_Logo-1.jpg","contentUrl":"https:\/\/www.itq.de\/wp-content\/uploads\/2019\/03\/ITQ_Logo-1.jpg","width":1442,"height":812,"caption":"ITQ GmbH"},"image":{"@id":"https:\/\/www.itq.de\/en\/#\/schema\/logo\/image\/"}},{"@type":"Person","@id":"https:\/\/www.itq.de\/en\/#\/schema\/person\/06a2fb9fd2f95dcebebedd110a16d27e","name":"Anis Kossentini","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.itq.de\/en\/#\/schema\/person\/image\/","url":"https:\/\/secure.gravatar.com\/avatar\/3085b577714a8c5fc859f06be797ec3d57b30c3e4a2b6d8842c1f0a5141291cc?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/3085b577714a8c5fc859f06be797ec3d57b30c3e4a2b6d8842c1f0a5141291cc?s=96&d=mm&r=g","caption":"Anis Kossentini"},"sameAs":["https:\/\/www.itq.de"],"url":"https:\/\/www.itq.de\/en\/author\/kossentini\/"}]}},"_links":{"self":[{"href":"https:\/\/www.itq.de\/en\/wp-json\/wp\/v2\/posts\/17184","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.itq.de\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.itq.de\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.itq.de\/en\/wp-json\/wp\/v2\/users\/7"}],"replies":[{"embeddable":true,"href":"https:\/\/www.itq.de\/en\/wp-json\/wp\/v2\/comments?post=17184"}],"version-history":[{"count":0,"href":"https:\/\/www.itq.de\/en\/wp-json\/wp\/v2\/posts\/17184\/revisions"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.itq.de\/en\/wp-json\/wp\/v2\/media\/17112"}],"wp:attachment":[{"href":"https:\/\/www.itq.de\/en\/wp-json\/wp\/v2\/media?parent=17184"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.itq.de\/en\/wp-json\/wp\/v2\/categories?post=17184"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.itq.de\/en\/wp-json\/wp\/v2\/tags?post=17184"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}